Founded in 2005, BOE HC SemiTek Corporation is a world leading semiconductor technology enterprise. It operates four smart manufacturing and R&D bases in Zhangjiagang, Yiwu, Yuxi and Zhuhai, with its administrative headquarters located in the Guangdong Macao In Depth Cooperation Zone in Hengqin.
Driven by technology, BOE HC SemiTek brings together global technical resources and top tier talents worldwide, earning an outstanding reputation for quality across the global LED chip market. Its LED chip portfolio covers all market segments, delivering tailored solutions to meet diverse customer requirements.
To build out the full chain LED industrial layout, BOE completed its acquisition of HC SemiTek in 2023, accelerating joint R&D and collaboration for Mini LED and Micro LED to achieve win win strategic outcomes.
Going forward, adhering to our core tenet: Empower customers to lead with chips; Build a better life with devotion, BOE HC SemiTek will pursue shared success with customers and joint innovation with industry partners, striving to become a world leading innovator in compound semiconductors.
*Data Source: TrendForce, as of Mar 2026
*As of Jun 09, 2026
Optical‑interconnect LED chips are electroluminescent semiconductor bare dies targeting short‑reach high‑speed optical interconnect applications. Different from LEDs for lighting and display, they are featured by high‑speed modulation, low power consumption and high‑density array integration. Serving as the core light source for short‑distance optical transmission, they are widely applied in inter‑board interconnect, chip‑scale optical interconnect, CPO, VLC visible‑light communication, consumer‑grade short‑reach optical transmission and other scenarios.
The Direct‑Display Division of BOE HC SemiTek was founded in 2007. At its inception, it introduced advanced overseas production lines and established close cooperation with well‑known Taiwan‑based chip vendors, achieving scaled production and sales simultaneously. In 2010, its sales revenue ranked No.2 domestically in the display screen segment, and climbed to No.1 the following year. With the commissioning of BOE HC SemiTek’s Zhangjiagang plant in 2013, the Direct‑Display Division further expanded its influence and market voice in China’s display niche market. It currently holds a 30% market share in the domestic segment, and maintains long‑term close partnerships with renowned domestic and international enterprises including Samsung, LG, Unilumin, Dongshan Precision, Ledman, Liantronics, Absen, Xida, Lehman, Nationstar and Jingtai.
The Backlight Division of BOE HC SemiTek dates back to 2014. Building on the company’s continuous breakthroughs in direct‑display and lighting markets, BOE HC SemiTek fully forayed into the backlight market in 2015 and quickly gained market traction. Following the commissioning of the Yiwu plant, BOE HC SemiTek actively introduced new‑generation production lines and leveraged its scale effect and cost advantages. The company has secured a position in the first‑tier camp of the backlight niche market, winning recognition from leading domestic and global manufacturers including LG, Samsung, BOE, Dell, ASUS, Xiaomi and Huawei.
The Lighting Division of BOE HC SemiTek originated in 2012. Benefiting from the booming domestic lighting market as well as the scale effect and cost advantages of the Zhangjiagang plant, full‑scale production was achieved in 2013. From 2012 to 2014, sales revenue successfully doubled, and the company grew to become TOP2 in its market segment in 2015. In recent years, BOE HC SemiTek has gradually expanded into high‑threshold niche markets including high‑efficacy lighting, specialty lighting, automotive lighting and horticultural lighting. It maintains close cooperation with renowned domestic and international packaging and end‑product enterprises such as Hongli, MLS, Jinko, Philips, GE Lighting, Osram, Ledvance, Cree, NVC Lighting and Inventronics.
The Innovation Division of BOE HC SemiTek originated back in 2012. Currently, it maintains close cooperation with well‑known domestic and international packaging and end‑user enterprises, including Philips, GE Lighting, Osram, Ledvance, Cree, NVC Lighting and Inventronics.
In 2025, BOE HC SemiTek held the Micro‑product delivery ceremony in Jinwan District, Zhuhai. The company officially launched and delivered COW and MPD products to customers, marking that Micro LED technology has entered a new phase of mass‑scale production.
BOE HC SemiTek self‑develops high‑performance infrared LED chips. Leveraging mature semiconductor manufacturing processes, the chips deliver outstanding photoelectric conversion efficiency with high luminous efficacy and low power consumption, greatly enhancing end‑user equipment experience. Featuring excellent resistance to current surge, the chips boast highly consistent optoelectronic parameters and favorable batch‑to‑batch uniformity, eliminating chromatic aberration and performance discrepancies. In addition, the products offer high stability and reliability with slow light degradation and long service life. They are widely applied in touch panels, blood oxygen monitoring and many other fields, providing core support of stable and high‑quality infrared light sources for end‑devices.
Customized services and full‑range products for vehicle lighting.
Application Categories: Headlamps, turn signal lamps, ambient lamps, etc.
Product Coverage: Matrix type, front‑mount / flip‑chip, etc.
Product Packages: 2016, 3127, 3139, 3152, etc.
Provide integrated light‑source solutions with high color gamut and high brightness.
Application Categories: Backlights for TV, MNT, DID, NB and automotive displays, etc.
Product Coverage: Direct‑lit / Edge‑lit, blue / white light, front‑mount / flip‑chip, etc.
Product Packages: 3030, 2016, 2835, 4014, etc.
Adopted advanced red‑light technology with abundant chip resources and strong technical capabilities.
Application Categories: Ceramic, PCT, etc.
Product Coverage: White light, blue light, red light
Product Packages: 3030, 2835, 3535, etc.
As a GaN‑based IDM enterprise, we independently accomplish the full workflow of substrate preparation and epitaxial wafer growth. Built on our self‑developed GaN epitaxial structure, devices achieve a lateral breakdown voltage (BV) of over 2000 V. The reliability margin of 700 V devices is greatly enhanced, and epitaxial technology for 1200 V devices is in reserve. Our products are widely deployed in fast charging, on‑board chargers, data center power supplies and other scenarios. Featuring high electron mobility and low on‑state loss, they drive energy‑efficiency upgrading across consumer electronics, new‑energy vehicles and industrial sectors, and support the full‑scenario implementation of “China‑made chips”.
Leveraging years of technological accumulation and innovative practices, BOE HC SemiTek has grown into a key player in the gallium nitride (GaN) sector. Since its establishment in 2005, over the past two decades, BOE HC SemiTek has continuously focused on the R&D and mass production of gallium‑nitride materials, building up a world‑leading nitride patent portfolio. Upholding independent R&D and market‑driven development, we are committed to delivering more efficient and reliable electronic solutions for customers. As an IDM company, our business footprint covers multiple links including device design, substrate, epitaxy and chip processing. We possess integrated advantages in design and manufacturing, enabling us to efficiently meet market demands and maintain sustainable development capabilities.
Mastering key processes including sapphire crystal growth, slicing and polishing. Its products cover sapphire substrate wafers for LED chips and sapphire materials for consumer electronics.
LED Sapphire Substrate Wafers: Provide foundational materials for semiconductor lighting and underpin downstream chip manufacturing.
Patterned Sapphire Substrate (PSS) is a key core material in the manufacturing of high‑end LED chips. By fabricating precise micro‑nano patterned structures on the substrate surface, it can significantly improve the luminous efficiency and performance of LEDs.
The basic principle of LED epitaxial wafer growth is to deliver gaseous substances in a controlled manner onto the surface of a substrate (mainly sapphire and GaAs) heated to an appropriate temperature, so as to grow specific single‑crystal thin‑films. At present, metal‑organic chemical vapor deposition (MOCVD) is the dominant technology for LED epitaxial wafer growth. Substrate materials for LED epitaxial wafers serve as the cornerstone for technological advancement in the semiconductor lighting industry. Different substrate materials require distinct LED epitaxial growth technologies, chip processing technologies and device packaging technologies. Substrate materials determine the technical development roadmap of semiconductor lighting.
BOE HC SemiTek possesses leading‑edge mass‑production technologies. Its chips achieve industry‑leading performance in indicators including chip stability, ESD resistance and luminous efficiency.
