Part Name Planar Structure Chip Type Chip Size (mil2) Application Pad Size (μm) Pad Material Forward Current (mA) Power (mW) Forward Voltage (V) Dominant Wavelength (nm) Maximum Operating Current (mA)
HS17A-WA MP HS17A-WA MP 17*17 90 150 1.9-2.1 200
HS45A-WA MP HS45A-WA MP 45*45 110 350 1.9-2.1 700
HS60A-WA NPI HS60A-WA NPI 60*60 120 350 1.9-2.1 1200
FS45A-WA RD FS45A-WA RD 45*45 110 350 1.8-2.1 700
HS14A-SA RD HS14A-SA RD 13.5*13.5 95 20 1.8-2.3 70
BF43A-FC BF43A-FC 43*43 Chip 250 Sn Bump 50 Gap 200 65 2.6-2.8 400
BF40A-FC BF40A-FC 40*40 Chip 250 Sn Bump 50 Gap 200 65 2.6-2.8 400
Application Scenarios

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