Part Name Planar Structure Chip Type Chip Size (mil2) Application Pad Size (μm) Pad Material Forward Current (mA) Power (mW) Forward Voltage (V) Dominant Wavelength (nm) Maximum Operating Current (mA)
BF36A-CB BF36A-CB 35*35 Au: 318*784 T 150 Gap 150 350 2.8-3.3 700
BF28A-BD BF28A-BD 28*28 P: 519×185 N:567*209 T 150 Gap: 150 350 2.8-3.3 500
BF33A-BA NPI BF33A-BA NPI 33*33 P: 653×251.5 N: 753×301.5 T 150 GaP 150 700 2.8-3.3 1000
BF31P-CB BF31P-CB 12*29 Au: 259*283 T 150 Gap 175 150 2.8-3.2 180
BF30E-BB BF30E-BB 26*30 Au: 235*606 T 170 Gap 150 350 2.9-3.2 500
BA36R-BD BA36R-BD 17*34 65/65 Au 60 132-156 2.7-2.9 447.5-460 200
BA35R-BF BA35R-BF 15*32 65/65 Au 60 132-146 2.7-2.9 447.5-460 200
BA35R-BA (RD) BA35R-BA (RD) 13*31 60/60 Au 120 195-235 2.8-3.3 447.5-460 150
BA38Q-BC BA38Q-BC 20*38 70/70 Au 60 145-160 2.7-2.9 447.5‐460 240
BA38Q-BB BA38Q-BB 22*35 70/70 Au 60 139-162 2.7-2.9 447.5‐460 240
BA39P-BD BA39P-BD 26*40 70/70 Au 60 156-165 2.7-2.9 447.5‐460 265
BA45T-BA BA45T-BA 26*45 70/70 Au 60 156-165 2.7-2.9 447.5‐460 265
Application Scenarios

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