Optical Interconnect LED chips are electroluminescent semiconductor bare dies targeted for short‑reach high‑speed optical interconnects. Different from lighting and display‑oriented LEDs, they are mainly designed for high‑speed modulation, low power consumption and high‑density array integration. As core light sources for short‑distance optical transmission, they are widely adopted in inter‑board interconnects, chip‑level optical interconnects, CPO, VLC visible‑light communication, consumer‑grade short‑reach optical transmission and other scenarios.
Basic Definition and Luminescence Principle:
Nature: Light‑emitting chips based on Group III‑V semiconductor PN junctions, mostly in unpackaged bare‑die form, compatible with micro‑nano integration and co‑packaging processes.
Principle: Under forward bias, electrons and holes undergo radiative recombination, realizing direct conversion from electrical signals to optical signals.
Key Features: Direct modulation, no complex temperature control required, ultra‑simple structure and capability for large‑scale arraying. They constitute a core solution for low‑cost short‑reach high‑speed optical interconnects.
