Part Name Chip Type Chip Size (mil2) Application Pad Size (μm) Pad Material Test Current (mA) Radiant Flux (mW) Typical Luminous Flux Forward Current (mA) Luminous Intensity (mW) Forward Voltage (V) Dominant Wavelength (nm) Maximum Operating Current (mA)
A-BA35M-BCSCL
Front-mounted Chip 22*35 Automotive backlight 75 Au 120 185-215 2.7-3.0 445-455 350
A-BA35M-BCSCM
Front-mounted Chip 22*35 Automotive backlight 75 Au 120 180-210 2.7-3.0 455-465 350
A-BA40S-BASCC
Front-mounted Chip 22*40 Automotive backlight 80 Au 120 230-270 2.7-3.0 445-455 350
A-BA40S-BASDB
Front-mounted Chip 22*40 Automotive backlight 80 Au 120 220-260 2.7-3.0 455-465 350
A- BA51C-BB RD
Front-mounted Chip 25*51 Automotive backlight 70 Au 120 215-245 2.8-3.2 447.5-457.5 240
22*22 6V RD
Front-mounted Chip 22*22 Automotive backlight 76 Au 30 100-120 5.4-6 446-456 120
A-BF20O-BE
Flip Chip 6*20 Mini Automotive backlight gap150 Au 5 8.8-10.3 2.6-2.8 456.5-464.5 40
A-BY16H-BE 大角度
Flip Chip 9*16 Mini Automotive backlight gap130 Au 5 14.5-18.5 5.4-5.7 WLP441-451 40
BY16H-BD 大角度
Flip Chip 9*16 Mini车载背光 (去蓝) gap130 Au 5 14-16 5.4-5.7 WLP451-458 40
A-BY10A-BA
Flip Chip 10*10 Mini车载背光 gap85 Au 3 7.2-8.2 5.2-5.8 447-456 10
A-BY20A-BA
Flip Chip 20*20 Mini automotive backlight gap150 Au 15 45-48 5.3-5.8 WLP450-456 120
18*18 12V 大角度
Flip Chip 18*18 Mini automotive backlight gap150 Au 10 50-58 11-12 447-456 30
Application Scenarios

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