On September 11, the BOE Global Innovation Partner Conference 2025 (BOE IPC 2025), themed “Display-based IoT, AI Renewal,” grandly opened at the Beijing Zhongguancun International Innovation Center. BOE HC Semitek showcased multiple automotive-grade products and Micro LED innovative display solutions at the exhibition site, comprehensively demonstrating its technological breakthroughs and product innovations and setting a reliable benchmark for industry intelligentization.
Currently, the AR market continues to heat up and attracts close attention from both the industry and consumers. BOE HC Semitek launched a Micro LED 0.13-inch display module. As BOE HC Semitek’s first AR solution, the product features low power consumption, high brightness, good appearance yield, and high uniformity, with peak brightness reaching 400W nits. In microdisplay device manufacturing, the module adopts leading high-precision, low-damage processing technology and light-pattern modulation technology, achieving not only high-quality display effects but also mass-production capability. It represents an important breakthrough by BOE HC Semitek’s Micro LED Jinwan factory in technology and process. At present, the product can fully meet customer requirements and has officially opened for sample supply and sampling.
The Micro LED pixel automotive headlamp light-source module launched by BOE HC Semitek is an integrated light-source prototype module combining a Si-based CMOS driver and Micro LED chips. Relying on proprietary epitaxy and chip-integration processing technology, it can achieve dynamic lighting display with ten-thousand-level pixels under low power consumption and high brightness, supporting the intelligentization of high-end automotive lighting.In addition, the 6.2-inch full-color HUD co-developed by BOE HC Semitek was another highlight at the exhibition. It adopts a self-developed Micro RGB HUD display chip, significantly improving display performance and achieving high-definition imaging effects, and can be widely used in intelligent automotive fields.Also showcased was the P0.6 MPD dual-sided display. This product uses BOE HC Semitek’s advanced MPD packaging technology to create a P0.6 fine-pitch display, improving color consistency across viewing angles, delivering better image quality, featuring an ultra-thin structure, and achieving brightness of up to 1000 nits. It is suitable for diverse scenarios such as indoor large-screen displays, digital showrooms, and high-end conferences. Combined with dual-screen content linkage, it precisely adapts to scenarios, realizes deep integration of professional display and spatial aesthetics, and brings consumers a novel visual experience.
At the MLED sub-forum, Dr. Wang Jiangbo, Chief Technology Officer of BOE HC Semitek, delivered a keynote speech titled “Micro LED: New Trends in Chip-Display Intelligent Connectivity,” providing an in-depth analysis of Micro LED technology and application development trends. He stated that Micro LED technology is developing rapidly and has begun to emerge, driving innovation in smart wearables, automotive, and large-screen display technologies and opening an intelligent era of virtual-real interaction. According to TrendForce forecasts, in terms of market output value, Micro LED will take the lead in achieving economies of scale in large-size displays, while AR will gradually penetrate under AI-driven development; overall, most applications will unfold in 2026.
At present, BOE HC Semitek has developed large-size, low-defect-density, and high-wavelength-uniformity Micro LED epitaxial fabrication technology, has broken through high-yield Micro LED chip fabrication technology, and possesses high-precision fine-pitch batch fabrication capability for chips smaller than 5 μm. Regarding wafer size, he noted that BOE HC Semitek has continuously expanded from 4-inch and 6-inch wafers and will move toward 8-inch and 12-inch in the future, which is expected to bring cost benefits in epitaxy, chip processing, and transfer. In terms of technical capabilities, BOE HC Semitek has sub-micron-precision chip processing capability, high-quality mass transfer capability, and vertical stacking process capability for RGB three colors, and has launched 6-inch COW/COC products featuring high yield, high luminous efficiency, and good epitaxial uniformity.
As a new-generation display technology platform, MPD products have entered mass production and have been applied in multiple high-end display projects, demonstrating comprehensive advantages in display performance and customer usability. It is currently the best implementation solution in the fine-pitch true-pixel field, featuring high contrast, white-balance consistency, low-gray consistency, and aging stability. It can provide an excellent experience with high efficiency, high yield, and high adhesion, and has huge advantages in capacity and fixed-asset investment savings. It can be applied to scenarios such as high-end TVs and conference displays.
The future has arrived. As AI continues to empower everything, market demand for high-end display specifications is increasingly rising, and Micro LED technology is becoming an important pillar for output value growth in the display field. BOE HC Semitek actively collaborates with upstream and downstream partners, continues to increase innovation investment, continuously stimulates chip innovation vitality, and jointly promotes the innovation and application expansion of Micro LED technology.
